For reliability and repeatability, electronic component assembly is exclusively performed by machine. Artificial Optical Inspection, together with In-circuit and functional tests are performed as required, ensuring the best quality standards.
Substantial continuous investment, ahead of the requirement, ensures the latest state of the art machinery… and the knowledge to use it.
Manufacturing capabilities include:
BGA & FBGA placement - ball size to 0.2mm and minimum pitch of 0.3mm.
Advanced 3D Solder paste volume auto testing
SMT components down to 01005.
Artificial Optical Inspection — AOI. ( for both Pre & Aft. IR reflow )
X-Ray inspection.
In Circuit Test — ICT. ( Fully automated multi-testing station array )
Functional PCBA tests.
Lead free double wave-front flow solder and lead free IR reflow with nitrogen generation plant.
In house developed Production monitoring system with real time data havest, sharing and analysis.
Industrial 4.0
Under the framework of Industrial 4.0, our in house developed manufacturing information system is to provide complete coverage of information harvesting , sharing and control from supply chain management, warehouse, automated shop floor, assembly line planning to customer management. It facilitates the future requirement of a Flexible Manufacturing system.
Kingtronics 'the complete solution',
…committed to total customer satisfaction.