For reliability and repeatability, electronic component assembly is exclusively performed by machine. Artificial Optical Inspection, together with In-circuit and functional tests are performed as required, ensuring the best quality standards. |
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Substantial continuous investment, ahead of the requirement, ensures the latest state of the art machinery… and the knowledge to use it. |
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Manufacturing capabilities include: |
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BGA & FBGA placement - ball size to 0.2mm and minimum pitch of 0.3mm. |
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Advanced 3D Solder paste volume auto testing |
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SMT components down to 01005. |
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Artificial Optical Inspection — AOI. ( for both Pre & Aft. IR reflow ) |
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X-Ray inspection. |
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In Circuit Test — ICT. ( Fully automated multi-testing station array ) |
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Functional PCBA tests. |
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Lead free double wave-front flow solder and lead free IR reflow with nitrogen generation plant. |
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In house developed Production monitoring system with real time data havest, sharing and analysis. |
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Industrial 4.0 |
Under the framework of Industrial 4.0, our in house developed manufacturing information system is to provide complete coverage of information harvesting , sharing and control from supply chain management, warehouse, automated shop floor, assembly line planning to customer management. It facilitates the future requirement of a Flexible Manufacturing system. |
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Kingtronics 'the complete solution',
…committed to total customer satisfaction. |